Camera Module

Camera Module
CAMERA MODULE
By leveraging our specialized expertise in optics, mechanics, circuitry and manufacturing processes, NAMUGA delivers high-resolution, ultra-compact camera solutions tailored to meet the precise needs of our customers.
Camera Module
Miniaturization Lightweighting
Miniaturization
Lightweighting
Intrinsic Calibration
Intrinsic
Calibration
Active Align
Active Align
High-end OIS
Iris & Facial Recognition
Iris &
Facial Recognition
Specification
Mobile Single Camera Module
Resolution Type Note
single VGA~32M Fixed Focus
(Active Align)
Active Align technology to
achieve miniaturization and slim designs
Compact Wide-Angle Camera Module for Front-facing
single 5M~108M Auto Focus
(Wide)
Supporting high-resolution imaging
High-Definition Closed-Loop Auto Focus for Front and World View
single 5M~16M Fixed Focus, Auto Focus
(Ultra Wide)
Achieving ultra-wide angles of over 120 degrees
Ultra-Wide Angle Camera for World View
Mobile Multi Camera Module
  • Dual Calibration technology and multi-camera setups including AF (wide), AF/FF (ultra-wide and) FF (macro, bokeh) functions
Mobile Multi Camera Module
Resolution Type
Mobile Multi Camera Module 5M UM + 108MAF + 5M Macro Fixed Focus (Macro / Bokeh)
5M UW + 108M AF + 5M Macro Multi Calibration Camera
5M FF+16M AF Fixed Focus, Auto Focus (Ultra Wide)
5M UW + 16M AF Multi Camera
2M UW + 5M AF Auto Focus (Wide)
2M UW + 5M AF Low cost Multi Camera
Core Technology
PKG Process
  • High-performance automated equipment and professional workforce.
  • Securing process capabilities to satisfy customer requirements (Screwless, Active Align, IR Camera, etc.)
  • Stable Quality Assurance
  • Active Align Assembly
  • Multi Camera Assembly
  • Full Automation for AF Lens, Actuator (OIS), and Filter Assembly
  • 3D Depth Cal/Val Automation
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Compact Camera Solution
  • Innovative Ultra-compact Camera Module Design: We offer design solutions for camera modules that are significantly smaller than standard products, tailored for AR/VR, mobile devices, and emerging applications.
  • Advanced Manufacturing Capabilities: We are fully equipped with the state-of-the-art facilities and expertise required to produce ultra-compact camera modules.
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Package Solution
COB
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  • Conventional features
MOC on CSP
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  • Active Alignment (*MOC) Process
  • Chip Scale Package
  • No Barrel Focusing
  • Small Footprint(X,Y)
WLO
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  • Wafer Level Optic
  • Reflowable
  • Active Alignment
  • Super Small *FP(X,Y)
  • Slim TTL(Z)
Meta Lens
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  • Meta Lens(+*GMO)
  • Reflowable
  • Active Alignment
  • Super Small *FP(X,Y)
  • Super Slim TTL(Z)
*MOC : Mount On the Chip / *FP : Focused Package / *GMO : Glass Mold Optic
Go to Business
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